Dynamic ultrafast laser spatial tailoring for parallel micromachining of photonic devices in transparent materials
Abstract
Femtosecond laser processing of bulk transparent materials can generate localized positive changes of the refractive index. Thus, by translation of the laser spot, light-guiding structures are achievable in three dimensions. Increasing the number of laser processing spots can consequently reduce the machining effort. In this paper, we report on a procedure of dynamic ultrafast laser beam spatial tailoring for parallel photoinscription of photonic functions. Multispot operation is achieved by spatially modulating the wavefront of the beam with a time-evolutive periodical binary phase mask. The parallel longitudinal writing of multiple waveguides is demonstrated in fused silica. Using this technique, light dividers in three dimensions and wavelength-division demultiplexing (WDD) devices relying on evanescent wave coupling are demonstrated.