Dynamic ultrafast laser spatial tailoring for parallel micromachining of photonic devices in transparent materials - Université Jean-Monnet-Saint-Étienne Access content directly
Journal Articles Optics Express Year : 2009

Dynamic ultrafast laser spatial tailoring for parallel micromachining of photonic devices in transparent materials

Abstract

Femtosecond laser processing of bulk transparent materials can generate localized positive changes of the refractive index. Thus, by translation of the laser spot, light-guiding structures are achievable in three dimensions. Increasing the number of laser processing spots can consequently reduce the machining effort. In this paper, we report on a procedure of dynamic ultrafast laser beam spatial tailoring for parallel photoinscription of photonic functions. Multispot operation is achieved by spatially modulating the wavefront of the beam with a time-evolutive periodical binary phase mask. The parallel longitudinal writing of multiple waveguides is demonstrated in fused silica. Using this technique, light dividers in three dimensions and wavelength-division demultiplexing (WDD) devices relying on evanescent wave coupling are demonstrated.
Not file

Dates and versions

ujm-00363750 , version 1 (24-02-2009)

Identifiers

  • HAL Id : ujm-00363750 , version 1

Cite

Cyril Mauclair, Guanghua Cheng, Nicolas Huot, Eric Audouard, Arkadi Rosenfeld, et al.. Dynamic ultrafast laser spatial tailoring for parallel micromachining of photonic devices in transparent materials. Optics Express, 2009, 17 (5), pp.3531. ⟨ujm-00363750⟩
39 View
0 Download

Share

Gmail Facebook Twitter LinkedIn More