S. Hunsche, A new paradigm for in-line detection and control of patterning defects, Proc. of SPIE, vol.9424, p.2015

A. Szucs, Advanced OPC Mask-3D and Resist-3D modeling, Proc. of SPIE, vol.9052, p.2014
DOI : 10.1117/12.2047281

D. Fuchimoto, Measurement technology to quantify 2D pattern shape in sub-2x nm advanced lithography, Metrology, Inspection, and Process Control for Microlithography XXVII, 2013.
DOI : 10.1117/12.2012661

J. Simiz, Product layout induced topography effects on intrafield levelling, Proc. of SPIE, vol.9661, p.2015
URL : https://hal.archives-ouvertes.fr/ujm-01272856

J. Simiz, Predictability and impact of product layout induced topology on across-field focus control, Proc. of SPIE, vol.9424, p.2015
URL : https://hal.archives-ouvertes.fr/ujm-01272848

K. Park, Improvement of inter-field CDU by using on-product focus control, Proc. of SPIE, vol.9050, p.2014